Process

Production Expertise

Our staff represents over 60 years of extensive experience in the semiconductor industry. SST provides a high yield service which results in lower unit wafer costs. Our process minimizes the amount of material removed from the wafer surface which in turn allows our customers to extend the life cycle of a test wafer. We provide total solutions to your silicon wafer needs by tailoring our process to each individual customer specification.

The Process

The standard reclaim process begins with an incoming sort and characterization. If necessary, films on the wafer are removed through chemical strip, followed by a lap process, if applicable. A tailored polish step removes a minimal amount of silicon and leaves the wafer with a flat mirror finish. Our cleaning process routinely produces wafer with less than 50 particles @ 0.16 um for 200mm wafers and less than 30 @ 0.2 um for 150mm wafers.